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Hprobe to exhibit at InterMag 2023 in Sendai Japan - May 15-19

As a major industry provider of turnkey semiconductor ATE for magnetic devices, Hprobe is participating and showcasing their line of products at InterMag 2023, being held at the Sendai International Conference Center in Sendai, Japan from May 15 to 19. If you are planning to attend - you are invited to stop by booth #36 to meet the team & learn about the latest developments in ATE for NVM and magnetic sensors R&D/production applications.


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