NANI's solution partners and providers servethe following device, thin film and materials markets of North America per the following:

• 2D Materials R&D Including:

  • Graphene

  • TMD 

  • MoS2 &MoSe2 

  • WS2 & WSe2 

• Aerospace R&D and manufacturing

• Academic R&D

• Bio-tech R&D and manufacturing

• Compound (III-IV) Semiconductor R&D and manufacturing including: 

  • ​Transistors

  • Integrated Circuits

  • Diodes

  • Rectifiers

• Data Storage R&D and manufacturing including:

  • HDDs (Media & TFH)

  • SSDs

  • Tape

• Defense R&D and manufacturing

• Government Laboratory R&D​

• Med-tech R&D and manufacturing

• MEMS R&D and manufacturing including:

  • Acoustic

  • Mechanical 

  • Microfluidics

  • Optical

  • Sensors

  • Transducers

  • RF devices

• Photonics & Opto-electronics R&D and manufacturing including:

  • Amplifiers

  • Aspherical & Spherical Lenses

  • BAW filters

  • CCDs

  • DLC coatings

  • FLIR

  • Image Sensors

  • IOCs

  • IR Component

  • Laser diodes/VCSELs​

  • Laser Li-F

  • LCDs

  • LED/OLED

  • LIDAR

  • Modulators

  • Optical coatings

  • Optically active quantum dots

  • Optocouplers

  • Optoisolators

  • Perovskite transistors

  • Photodetectors

  • Photodiodes

  • Photomutipilers

  • Photoresistors

  • Plasmanic nanostructures

  • Quantum cascade lasers

  • Ring laser gyroscopes

  • SAW filters

  • Waveguides

  • Solar Cells (see below)

• Photovoltaic R&D and manufacturing including:

  • a-Si​

  • c-Si

  • CdTe

  • CIGS

  • CVP/HCVP

  • DSSC

  • GaAs

  • Mono/Multi-Si

  • OPV​

• Process equipment manufacturers including:

  • Photolithography

  • Ash/Strip/De-scum

  • Dep​ (PVD, CVD, IBD, ALD, PECVD)

  • Etch (RIE, IBE, Ion Milling)

  • Anneal (High temp., RTA, high/low field magnetic anneal)

  • Ion Implant

• RF Device R&D and manufacturing including:

  • Attenuators

  • Fixed Attenuator Pads

  • MIS Capacitors

  • Binary Capacitors

  • Beam Lead Capacitors

  • Lange Couplers

  • Diode Submounts

  • Filters

  • Inductor Coils

  • Resistors

  • Standoff Capacitors

  • Transmission Lines

  • Thin Film Circuits

  • Planar Chip Inductors

• Memory R&D and manufacturing

  • 3D-Xpoint

  • EPROM

  • EEROM

  • CBRAM

  • DRAM

    • EPM​

    • EDO

    • SDRM

    • VRAM

    • SGRAM

  • Flash

  • SRAM

  • NVM​​

    • Flash

    • NVRAM

    • ROM​

• Semiconductor R&D and manufacturing including:​

  • ASICs/ASPPs

  • CPUs

  • DSPs/CSPs

  • Microcontrollers

  • MCUs

  • MPUs

  • Processors

  • SoCs

  • Transistors

  • Thyristors

  • PIN Diodes

  • Beam Lead PIN Diodes

  • Limiter Diodes

  • Step Recovery Diodes

  • Point Contact Diodes

  • Schottky Diodes

  • Schottky Barrier Bridge Quads

  • Schottky Barrier Ring Quads

  • Zero Bias Schottky Detector Diodes

• Spintronics R&D and manufacturing including:

  • Non-volatile memory (all flavors)

  • Capacitors

  • Inductors & transducers

  • MR/TMR sensors

• Test equipment manufacturers 

• Thin film battery R&D and manufacturing including:

  • LiPON-based

  • Stackable thin-film battery

  • 2D and 3D Micro-battery

  • Primary Li/CFx micro-battery

  • Flexible lithium-ion battery

  • Thin and flexible alkaline battery

  • Lithium manganese disposable battery

  • Laminated packaged lithium-polymer cells

  • Batteries with highly conductive polymer gel electrolyte

  • Solid-state battery

  • Cable-type battery

  • Large-area multi-stacked textile battery

  • Stretchable battery

  • Foldable Kirigami lithium-ion battery

  • Fibre-shaped lithium-ion battery that can be woven into electronic textiles

  • Printed zinc-carbon disposable battery

  • Printed silver zinc battery

  • Printed rechargeable NMH battery

  • Needle battery

  • Transparent battery

  • Laminar fuel cells

  • Thin and flexible supercapacitors

  • Printed supercapacitors