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Avalanche & UMC Announce 22nm Production of Hi-Density MRAM-Based Devices for Aerospace Applications

(BUSINESS WIRE, Sept. 12, 2022) FREMONT, Calif. & HSINCHU, Taiwan

Avalanche Technology, the leader in next generation MRAM technology, and United Microelectronics Corporation (NYSE: UMC; TWSE: 2303) (“UMC”), a leading semiconductor foundry, announced today the immediate availability of new High-Reliability Persistent SRAM (P-SRAM) memory devices through UMC’s 22nm process technology. Based on Avalanche Technology’s latest generation of Spin Transfer Torque Magnetoresistive RAM (STT-MRAM) technology, this much anticipated third generation product platform offers significant density, endurance, reliability and power benefits over existing non-volatile solutions.


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