Global IC Fabs And Facilities Report: 2024

(Semiconductor Engineering, Jan.21st) The chip industry made significant capital investments this year to build new fabs and facilities or expand existing premises. A number of sites were dedicated to SiC, GaN, DRAM, HBM, along with packaging and assembly by OSATs, and essential gases, chemicals, and other components. More than a dozen R&D centers were also established for 8-inch wafers, EUV, and advanced packaging. Investments came from both companies and government sources, and many CHIPS Act awards have now been finalized (See link for details).

https://semiengineering.com/chip-industry-investments-kept-flowing-in-2024-even-as-some-projects-stalled/?cmid=ac4f34d6-e4a9-4f9d-a0ac-0fdb020eab2e