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Nordiko designs & manufactures a broad range of PVD and ion-beam process tools for both R&D and production applications, specializing in tools for magnetic, ferroelectric, piezoelectric and spintronic device fabrication. Nordiko supports customers in the spintronics, data storage, MEMS, and photonics markets worldwide.
Mnem-iX Broad Ion Beam System
When Precision is paramount and the Mnem-iX has a track record of achievement for MRAM production. Mnem-iX uses a central, industry standard, wafer handling platform. The platform can be equipped with two 3600 or 3800 deposition modules and two smaller 7000 series modules. The latter may be used for wafer pre-clean and surface modification.
8800 PVD System
The N8800 physical vapour deposition module is an automated process machine that may be interfaced to a vacuum load lock. The chamber can accommodate up to ten sputtering electrodes. Two deployed on each of the five electrode facets. The system may be equipped with DC and or RF power supplies for powering the sputtering cathodes. With one power supply the system may be used for the sequential deposition of up to ten materials. With two, or more, sputtering supplies it may also be configured to co-sputter from adjacent cathodes.
7500 Broad Ion Beam Milling system
The 7500 delivers the performance needed when manufacturing a nano scale world. This results in repeatable milling performance with very good within wafer non-uniformity from a very low divergence collimated ion beam. Dual plasma bridge neutralisers couple electrons to the beam plasma for effective charge neutralisation at illuminated surfaces. Interfaced to an industry standard SEMI MESC compliant wafer handling platform the system may be configured for processing various wafer sizes up to 200 mm diameter and platens up to 225 mm square.
3400/3600/3800 Broad Ion Beam Deposition Systems
The 3400/3600/38000 are advanced automatic vacuum coating systems designed for the deposition of dielectric and metallic films. The modules are equipped to be interfaced to a wafer handling platform (SEMI height). A single ion source illuminates the selected one, of four/six/eight available, target positions creating a deposition flux. An auxiliary ion source aimed at the substratetable is available as an option that can be used for wafer pre-clean and/or direct illumination of the growing film.
High Volume Manufacturing (HVM) Systems provide the highest throughput via a 50-100 X 200/300mm wafer batch. The HVM systems are in wide use within the data storage and spintronics markets.
N2000 Compact Sputter System
The N2000 is a compact sputtering system with four 150 mm electrodes mounted in a confocal configuration. The electrodes sputter material onto a central rotating worktable. Designed to coat substrates up to 200 mm diameter the system combines great flexibility with substantial capability.
2000 and 2550 Series Batch Load PVD Systems
The 2000 and 2550 share a common process module. The 2000 may be configured either for atmospheric cycling to load a batch, or with a single shot load lock. When this moduleis mated to a wafer handling platform that accesses a vacuumcassette load lock then the machine designation becomes the 2550.
5000 Configurable Process Module
The new 5000 series uses a modular reactor format that may be configured for a variety of process functions. These include Physical Vapour Deposition (PVD, or sputtering), vacuum evaporation (thermal and e-beam), Reactive Ion Etching (RIE), High Density Plasma Enhanced Chemical Vapour Deposition(HD PECVD), vacuum annealing and precision oxidation.
8000 & 8550 Series Batch Load PVD Systems
The 8000 and 8550 share a common process module. The 8000 may be configured either for atmospheric cycling to load a batch, or with a single shot load lock. When this module is mated to a wafer handling platform that accesses a vacuumcassette load lock then the machine designation becomes the 8550.
9000 & 9550 series batch load PVD
The 9000 and 9550 share a common process module. The 9000 may be configured either for atmospheric cycling to load a batch or with a single shot load lock. When this module is mated to a wafer handling platform that accesses a vacuumcassette load lock then the machine designation becomes the 9550.
The Nordiko N1500-600 is a cold wall, large area, RFexcited PECVD reactor. Configured for batch loading the system is highly configurable and able to accept a wide variety of substrate shapes and sizes, up to 500 mm diameter.
N300 Laboratory Scale Sputtering System
The N300 is the smallest of Nordiko’s sputtering systems utilizing an aluminium chamber and can accommodate up to four 75 mm sputtering cathodes. An alternative configuration is to install a single larger (150 or 200 mm) electrode. Each cathode may be configured for DC and or RF operation.
The Nordiko alpha-120 laboratory system comprises a vacuum process module, mounted on a cabinet housing supporting power supplies and power management systems. The system may beconfigured for atmospheric cycling to load samples, or may be fitted with a vacuum load lock.