Welcome To Our Family of Thin Film Process & Test Solutions!
Trion manufactures a wide variety of systems for the Compound Semiconductor, MEMS, Opto-Electronic and other markets. Our products feature the smallest footprint and lowest cost systems in the industry with proven production reliability. If you wish anything from full-blown production cluster tools to a simple laboratory system, Trion makes it.
The Oracle III is the smallest and most flexible full production cluster system on the market. The system consists of a central vacuum transport (CVT), vacuum cassette elevators and up to four process reactors. These process reactors are docked to the central load-lock and run in production-mode or can be operated independently. The Oracle III can also be configured for either the laboratory environment (with single wafer loading) or for full production (with vacuum cassette elevators).
The Titian is a compact, fully automated, vacuum load-locked Plasma System for semiconductor production
Available in either reactive ion etch (RIE) configuration, high-density inductive coupled plasma (HDICP) or plasma enhanced chemical vapor deposition (PECVD) configuration. Used for advanced processing of wafers from 3" to 300mm in diameter. It also has multiple size batch capability. Small footprint at an affordable price.
Etch Applications: GaAs, AlGaAs, GaN, InP, Al, Silicides, Chrome and other materials requiring both corrosive and non-corrosive chemistries.
Deposition Applications: Si02, Si3N4, Oxynitride, and various other materials.
The Orion PECVD system produces production-quality films on a compact platform. The unique reactor design produces low stress films with excellent step coverage at extremely low power levels. The system meets all safety, facility and process requirements within the laboratory and pilot line production environments. The Orion has many standard features not typically found on a system so reasonably priced, which is why many users worldwide have made it their PECVD system of choice.
Single wafers, dies or parts (up to 300mm)
Non-pyrophoric PECVD processes
Films deposited: oxides, oxynitrides, nitrides, amorphous silicon
Process gases: <20% silane, ammonia, TEOS, diethylsilane, nitrous oxide, oxygen, nitrogen
Temperature controlled chuck to 400°C
Optional top-powered triode source (dual frequency power)
High throughput pumping systems.
Trion manufactures a wide variety of systems for the R&D, Compound Semiconductor, MEMS, Opto-Electronic and other markets. Trion RIE systems feature the smallest footprint and lowest cost in the industry with proven production reliability.
Trion Strippers are compact, inexpensive and versatile systems, which can handle 100-300mm wafers. With our systems, difficult to remove layers of resist can be removed at low temperatures.