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Process
The following is a partial list of common search terms...........
Process​
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Active deposition
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Anneal
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Ash
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Atomic layer deposition (ALD)
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Back-etch
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Broad Ion beam deposition
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Co-sputtering
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CMP
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Contamination
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Cross contamination
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DC Magnetron
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Defect
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Delamination
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Deposition
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Deposition rate
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De-scum
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Dielectric deposition
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Dielectric etch
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Diffusion
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Donors
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Dopping
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Dry etch
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Etch
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Etch Rate
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Etch Profile
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Ecthant
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Edge effect
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Edge exclusion
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End point detection
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Epitaxy
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Evaporation
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Exclusion zone
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Flux
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Flux density
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Furnace
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High field magnetic anneal
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Homogeneity
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Implantation
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Impurities
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Ion beam etch
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Inductively coupled plasma (ICP)
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Incidence angle
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Initialize
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Interface
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Interfacial effects
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In-situ film thickness monitoring
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Ion assisted depostion
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Ion current
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Ion incidence angle
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Ion Milling
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Ion Source
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ionization
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Isotropic etch
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Isotropy
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Lift-off
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Magnetic anneal
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Magnetize
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Magnetic saturation
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Magnetic Vacuum Annealing
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Magnetron
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Masking
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Matching network
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Metal deposition
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Metal etch
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Metalization
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Milling
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Molecular Beam Epitaxy (MBE)
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Monolayer
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Non-uniformity
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Oxidation
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Paterning
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Particles
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Passive deposition
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Passivation
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Photolithography
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Physical vapor deposition (PVD)
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Physically Enhanced Chemical Vapor Depostion
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Pin-hole
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Plasma
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Plasma density
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Plasma etch
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Plasma process
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Plasma Source
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Polysilicon etch
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Process drift
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Process of record (POR)
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Pulsed Laser Deposition
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Race track
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Rapid thermal anneal
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Reactive Ion Beam Etch
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Reactive Ion Etch
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Repeatability
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RF Magnetron
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Rotation
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Rotating magnet array
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Scrap
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Secondary Ion Mass spectroscopy
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Selectivity
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Shadowing
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Skew Angle
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Skew angle range
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Soft etch
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Sputtering
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Sputter etch rate (thermal oxide)
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Sputter Threshold
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Static Depostion
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Strip
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Substrate heating/cooling
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Target
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Target thickness
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Target poisoning
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Thermal oxidation
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Thickness WIW
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Thickness WTW non-uniformity (full target life)
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Tilt
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Unifomity
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Vacuum
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Wafer cooling/heating
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Wafer to wafer untifomity
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Wafer-to-Wafer Repeatability
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Wet etch
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Within Wafer uniformity
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Backing pate
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Rotating magnet array