Process

The following is a partial list of common search terms...........

Process

  • Active deposition

  • Anneal

  • Ash

  • Atomic layer deposition (ALD)

  • Back-etch

  • Broad Ion beam deposition

  • Co-sputtering

  • CMP

  • Contamination

  • Cross contamination

  • DC Magnetron

  • Defect

  • Delamination

  • Deposition

  • Deposition rate

  • De-scum

  • Dielectric deposition

  • Dielectric etch

  • Diffusion

  • Donors

  • Dopping

  • Dry etch

  • Etch

  • Etch Rate

  • Etch Profile

  • Ecthant

  • Edge effect

  • Edge exclusion

  • End point detection

  • Epitaxy

  • Evaporation

  • Exclusion zone

  • Flux

  • Flux density

  • Furnace

  • High field magnetic anneal 

  • Homogeneity

  • Implantation

  • Impurities

  • Ion beam etch 

  • Inductively coupled plasma (ICP)

  • Incidence angle

  • Initialize

  • Interface

  • Interfacial effects

  • In-situ film thickness monitoring

  • Ion assisted depostion

  • Ion current

  • Ion incidence angle

  • Ion Milling

  • Ion Source

  • ionization

  • Isotropic etch

  • Isotropy

  • Lift-off

  • Magnetic anneal

  • Magnetize

  • Magnetic saturation

  • Magnetic Vacuum Annealing

  • Magnetron

  • Masking

  • Matching network

  • Metal deposition

  • Metal etch

  • Metalization

  • Milling

  • Molecular Beam Epitaxy (MBE)

  • Monolayer

  • Non-uniformity

  • Oxidation

  • Paterning

  • Particles

  • Passive deposition

  • Passivation

  • Photolithography

  • Physical vapor deposition (PVD)

  • Physically Enhanced Chemical Vapor Depostion

  • Pin-hole

  • Plasma

  • Plasma density

  • Plasma etch

  • Plasma process

  • Plasma Source

  • Polysilicon etch

  • Process drift

  • Process of record (POR)

  • Pulsed Laser Deposition

  • Race track

  • Rapid thermal anneal

  • Reactive Ion Beam Etch

  • Reactive Ion Etch

  • Repeatability 

  • RF Magnetron

  • Rotation

  • Rotating magnet array

  • Scrap

  • Secondary Ion Mass spectroscopy

  • Selectivity

  • Shadowing

  • Skew Angle 

  • Skew angle range

  • Soft etch

  • Sputtering

  • Sputter etch rate (thermal oxide)

  • Sputter Threshold

  • Static Depostion

  • Strip

  • Substrate heating/cooling

  • Target

  • Target thickness

  • Target poisoning

  • Thermal oxidation

  • Thickness WIW

  • Thickness WTW non-uniformity (full target life)

  • Tilt

  • Unifomity

  • Vacuum

  • Wafer cooling/heating

  • Wafer to wafer untifomity

  • Wafer-to-Wafer Repeatability

  • Wet etch

  • Within Wafer uniformity

  • Backing pate

  • Rotating magnet array

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North Amiercan Nanotech, Inc.                                           Contact Us:

12701 Welcome Lane                                                               P. 612-819-5149

Burnsville, MN 55337                                                              E. northamericananotech@icloud.com

www.northamericananotech.com                                      Skype. dmmontag612