Search Terms

The following is a partial list of common search terms...........

Applications

  • 2D Materials

  • Bio-tech

  • Compound (III-IV) Semiconductora

  • Functional test

  • Hard drive disks

  • LCD/LED/OLED

  • LIDAR

  • Magnetic MEMS

  • Magnetic sensor

  • Med-tech

  • MemoryD

  • MEMS

  • Microfluidics

  • MRAM test

  • Non-volatile memory (all flavors)

  • Opto-electonics

  • Photonics

  • Photovoltaic cells

  • Recording tape

  • Semiconductors

  • Sensors (Hall/AMR/GMR)

  • Solid State Memory (SSD)

  • Spintronics

  • Thin film batteries

  • Thin film heads

Devices

  • ASIC

  • Diodes

  • Integrated Circuits

  • Flux guides

  • Rectifiers

  • ​Transistors

  • Discrete

  • Mixed signal

  • Power

  • Hall effect sensor (magnetic field sensor)

  • Photocoupler (Optocoupler)

  • Acoustic

  • Mechanical 

  • Microfluidics

  • Microstatures 

  • Optical

  • RF devices

  • Sensors

  • Transducers

  • Amplifiers

  • Aspherical & Spherical Lenses

  • CCDs

  • DLC coatings

  • FLIR

  • Image Sensors

  • IOCs

  • IR Component

  • Laser diodes/VCSELs​

  • Laser Li-F

  • LCDs

  • LED/OLED

  • LIDAR

  • Modulators

  • Optical coatings

  • Optically active quantum dots

  • Optocouplers

  • Optoisolators

  • Perovskite transistors

  • Photodetectors

  • Photodiodes

  • Photomutipilers

  • Photoresistors

  • Plasmanic nanostructures

  • Quantum cascade lasers

  • Ring laser gyroscopes

  • Solar Cells (see below)

  • Waveguides

  • a-Si​ Solar Cell

  • c-Si Solar Cell

  • CdTe Solar Cell

  • CIGS Solar Cell

  • CVP/HCVP

  • DSSC

  • GaAs

  • Mono/Multi-Si

  • OPV​

  • Attenuators

  • Beam Lead Capacitors

  • Binary Capacitors

  • Diode Submounts

  • Filters

  • Fixed Attenuator Pads

  • Inductor Coils

  • Lange Couplers

  • MIS Capacitors

  • Planar Chip Inductors

  • Resistors

  • Standoff Capacitors

  • Thin Film Circuits

  • Transformers

  • Transmission Lines

  • ASICs/ASPPs

  • ASSP

  • Beam Lead PIN Diodes

  • CMOS

  • CPUs

  • Die

  • Discrete

  • DSP

  • DSPs/CSPs

  • Field effect transistor

  • GPU

  • Limiter Diodes

  • MCE

  • MCUs

  • Microcontrollers

  • Mixed signal

  • MOS

  • MOSFET

  • MPUs

  • PIN Diodes

  • Point Contact Diodes

  • Power device

  • Processors

  • Schottky Barrier Bridge Quads

  • Schottky Barrier Ring Quads

  • SoCs

  • Step Recovery Diodes

  • Thyristors

  • Transistors

  • Zero Bias Schottky Detector Diodes

  • AR Sensor

  • GMR Sensor

  • MR Sensor

  • TMR Sensor

  • Capacitors

  • Inductors & transducers

  • MR/TMR sensors

  • Non-volatile memory (all flavors)

  • HAMR thin film head

  • HEMR thin film head

  • Thin film heads

  • Bipolar transistor

  • Darlington transistor

  • Field-effect transistor

  • Insulated-gate bipolar transistor (IGBT)

  • Silicon-controlled rectifier

  • Thyristor

  • TRIAC

  • Unijunction transistor

  • DIAC

  • Diode (rectifier diode)

  • Gunn diode

  • IMPATT diode

  • Laser diode

  • Light-emitting diode (LED)

  • Photocell

  • Phototransistor

  • PIN diode

  • Schottky diode

  • Solar cell

  • Transient-voltage-suppression diode

  • Tunnel diode

  • VCSEL

  • VOx

  • Zen diode

  • Zener diode

Features

  •  Anti-ferromagnetic order

  • Anti-refelctive coating

  • Antiferromagnetic

  • ARC

  • Array

  • Atomic plane

  • Band-gap

  • Barrier layer

  • Bi-layer

  • Capping-layer

  • Conduction band

  • Conductor

  • Crystal Lattice

  • Domain wall

  • Domain wall motion

  • Electron hole

  • Energy-band

  • film

  • Free layer

  • Gate

  • Grain boundry

  • Grain boundry distribution

  • Grain boundry size

  • Granula films

  • Heterostructure

  • in-plane

  • Interface

  • Junction

  • Lattice

  • Logic gate

  • Magnetic order

  • Magnetic-tunnel junction

  • Metal-oxide-semiconductor FET

  • Monocyrstal

  • Monolayer

  • Multidomain states

  • Multilayer

  • n-type

  • Nanocyrstal

  • Out of plane

  • p-n junction

  • p-type

  • Pinned Layer

  • Plug

  • Side wall 

  • Side wall domain

  • Side wall profile

  • Side wall velocity

  • Single crystal

  • Soft layer

  • Spin orbit

  • Spin orbit torque

  • Spin Valve

  • Substrate

  • Superlatice

  • Thin film

  • Transistor

  • Trench

  • Tunnel junction

  • Via

Film Specs

  • Aberations

  • Abrasion

  • Anisotropy

  • Conductivity

  • Emisivity

  • HA Coercivity

  • Hk mean

  • Interfacial stress

  • Isotropy

  • Magnetostriction

  • Permeability

  • Pin hole

  • Ra

  • Refractive index

  • Resistivity

  • Resistivity target (WIW and WTW)

  • Resistivity WIW and WTW non-unif (full target life)

  • Roughness

  • Stoiciometry

  • Stress

  • Stress related multi fields

  • Tensile

  • Thickness

  • Thermal conductiviy 

Materials

  • Aluminum

  • Aluminum Nitride

  • aluminum oxide

  • Amorphous 

  • Carbon

  • Chalcogenides

  • Chromium

  • Cobalt

  • Cobalt Iron

  • Cobalt Iron boron

  • Compound semiconductor

  • Conductor

  • Copper

  • Copper Nickle

  • Crystalyn

  • Diamond Like Carbon

  • Dielectirc 

  • Ferromagnetic

  • GaInP

  • Galium

  • Galium Arsinide

  • GaP

  • Germanium

  • Gold

  • Graphene

  • III-V

  • InAs

  • Indium

  • indium phosphide

  • Insulator

  • Iridium

  • Iron

  • Magnesium 

  • Magnesium Aluminum

  • Mangaense 

  • Mangaense Oxide

  • NCFO

  • Metal 

  • MoS2 &MoSe2 

  • Multiferroic

  • Nickle

  • Nickle Iron

  • PCl3, LiBH(C2H5)3

  • PH3

  • Photoresist

  • Platinum Mangaese

  • Pllatinum

  • Polyimide

  • Ruthenium

  • Saphire

  • Silicon

  • Silicon carbide

  • Silicon dioxide

  • Silicon Nitride

  • Silicon oxide

  • Silver

  • Tantalum

  • Tantalum Oxide

  • Tatalum

  • Thermal oxide

  • Titanim nitride

  • Titanium 

  • Titanium dioxide

  • TMD 

  • WS2 & WSe2 

Memory

  • 3D X-point

  • Anisotropic Magetoresistance

  • Bit line

  • CBRAM

  • Error rate

  • Free Layer

  • Giant Magnetoresistance

  • Head

  • In-plane MRAM

  • Mageto-resistive RAM

  • Magnetic Tunnel Junction

  • Memory

  • PCM

  • PCRAM

  • Perpendicular MRAM

  • Pinned Layer

  • PRAM

  • Random Access Memory

  • Reader

  • ReRam

  • SOT MRAM

  • SOT-RAM

  • Switching

  • Switching speed

  • Tape

  • Toggle-RAM

  • Tunnel-magnetoresistance

  • Writer

  • Hall effect

  • CMOX

Process

  • Active depostion

  • Anisotropy

  • Anneal

  • Ash

  • Atomic layer deposition (ALD)

  • Back-etch

  • Broad Ion beam deposition

  • Co-sputtering

  • CMP

  • Contamination

  • Cross contamination

  • Defect

  • Delamination

  • Deposition

  • De-scum

  • Dielectric deposition

  • Dielectric etch

  • Dry etch

  • Edge effect

  • Evaporation

  • Exclusion zone

  • Ion beam etch 

  • Inductively coupled plasma (ICP)

  • Incidence angle

  • Interface

  • Interfacial effects

  • In-situ film thickness monitoring

  • Ion Milling

  • Ion Source

  • ionization

  • Isotropic etch

  • Isotropy

  • Lift-off

  • Magnetic anneal

  • Magnetic saturation

  • Magnetic Vacuum Annealing

  • Magnetron

  • Masking

  • Matching network

  • Metal deposition

  • Metal etch

  • Milling

  • Molecular Beam Epitaxy (MBE)

  • Monolayer

  • Non-uniformity

  • Oxidation

  • Paterning

  • Particles

  • Passivation

  • Photolithography

  • Physical vapor deposition (PVD)

  • Physically Enhanced Chemical Vapor Depostion

  • Pin-hole

  • Plasma

  • Plasma density

  • Plasma etch

  • Plasma process

  • Plasma Source

  • Polysilicon etch

  • Pulsed Laser Deposition

  • Race track

  • Rapid thermal anneal

  • Reactive Ion Beam Etch

  • Reactive Ion Etch

  • RF Magnetron

  • Secondary Ion Mass spectroscopy

  • Selectivity

  • Shadowing

  • Skew Angle 

  • Skew angle range

  • Soft etch

  • Sputter etch rate (thermal oxide)

  • Sputter Threshold

  • Sputtering

  • Static Depostion

  • Strip

  • Substrate heating/cooling

  • Target

  • Target thickness

  • Target poisoning

  • Thermal oxidation

  • Thickness WIW

  • Thickness WTW non-uniformity (full target life)

  • Ultra-High Vacuum

  • Unifomity

  • Vacuum

  • Wafer cooling/heating

  • Wafer to wafer untifomity

  • Wafer-to-Wafer Repeatability

  • Wet etch

  • Withing Wafer uniformity

  • Backing pate

  • Rotating magnet array

Wafer handling

  • 100mm wafer

  • 150mm wafer

  • 2 axis arm

  • 200mm wafer

  • 3 axis arm

  • 300mm wafer

  • 450mm wafer

  • AlTIC wafer

  • Auto-load

  • Automation

  • Backside

  • Backside cooling

  • Backside heating

  • Baffle wafer

  • Batch

  • Batch-load

  • Bow

  • Breakage

  • Cassette

  • Cassette to cassette

  • Chemical Mechanical Polish

  • Chuck

  • Clamp

  • Clamping

  • Cluster tool

  • Contamination

  • Cooling station

  • Cycle-time

  • Dummy wafer

  • Dummy wafer

  • Edge exclusion

  • EFEM

  • Electrostatic Chuck

  • Elevator

  • End effector

  • Flat

  • FOUP

  • Frontside

  • In-situ rotation

  • Load-lock

  • Manual-load

  • Misalignment

  • Notch

  • Out-gassing

  • Pitch (cassette)

  • Platten

  • Pod

  • Pre-aligner

  • Pre-clean

  • Process carrier

  • Quartz carrier

  • Quartz cassette

  • Rework

  • Robot

  • Rotation

  • Saphire

  • Scrap

  • Silicon

  • Single wafer load

  • SMIF

  • Stainless Cassette

  • Substrate

  • TC wafer

  • Test wafers

  • Thermo-couple

  • Thickness

  • Through-put

  • Vacuum chuck

  • Wafer Batch

  • Wafer boat

  • Wafer bowing

  • Wafer clamping

  • Wafer tray

  • Wafers per hour (WPH)

  • Warping

Support

  • Down-time

  • Factory Acceptance

  • Final Acceptance

  • Mean time between failures

  • Mean time to repair

  • Mean time to respond

  • Preventative maintenance (PM)

  • Scheduled down-time

  • Unscheduled down-time

  • Up-time

Test & Measurement

  • 2D 

  • 3D

  • AFM

  • Array level test

  • ATE

  • Auger

  • Backscatter

  • Breakdown voltage

  • CIPT

  • Current pulses (generator)

  • Curve trace (IV family of curves)

  • DC probes

  • Device characterizationj

  • Device level test

  • Die leve test

  • Diffraction

  • EDS

  • EELS

  • Electrical Verification

  • Electron

  • Elipsometer

  • Endurance

  • ESD 

  • Fermi wavelength

  • Field angle dependence

  • Field projection

  • Focused ion beam

  • Functional test

  • Reflection High Energy Electron Diffraction 

  • Hysterisis loops

  • I/V curve

  • In-plane field

  • Interferometer

  • Ion

  • Magnetic coupling

  • Magnetic head

  • Magnetic test

  • Magnetoresistance curves

  • Magnetic resonances

  • Magneto-resistnace 

  • Magneto-striction

  • Manual wafer load

  • MFM

  • Microwave-frequency

  • MOKE

  • Optical microscope

  • Out of plane field

  • Package level test

  • Parametric test

  • Perpendicular field

  • Planar fiield

  • Probe card

  • Prober

  • Prober staton

  • Probes

  • Product validation

  • Property Mapping

  • Pulse Diagram

  • Pulse width

  • Pulse width dependence

  • Quasistatic Diagrams

  • Refractive index

  • Resistance distribution

  • RF characterization

  • RF probes

  • Secondary electron

  • Section

  • SEM

  • SIMS

  • Spectroscopy

  • SQUID

  • Sweep speed 

  • Switching Phase Diagram

  • Switching probability

  • Switching pulse currents

  • TEM

  • Temperature dependence

  • Thickness monitor

  • Time Domain Reflectometry (TDR)

  • Torque

  • Transmission Line Pulse (TLP)

  • Variable / Rotating in-plane field with fixed perpendicular field

  • Variable 3D magnetic field

  • Variable rotating in-plane field

  • Variable sweep rate

  • Variable uniaxial in plane magnetic field only

  • Variable uniaxial in-plane magnetic field with fixed perpendicular field

  • Variable uniaxial perpendicular magnetic field only

  • Variable uniaxial perpendicular magnetic field with fixed in-plane field

  • Voltage pulses

  • Voltage stress

  • VSM

  • Wafer cooling/heating

  • wafer level magnetic test

  • Wafer level test

  • WDS

  • XPS

  • XRD

  • X-Section

  • XPS

  • WDS

Vacuum

  • Ambient pressure

  • Atmosphere

  • Back-fill

  • Baffel 

  • Base vacuum

  • Bellows

  • Capacitance

  • Chamber

  • Cold cathode gauge

  • Cold finger

  • Cold trap

  • Conflat

  • Contamination

  • Controller

  • Convection

  • Cryo-pump

  • Diaphram

  • Diaphram pump

  • Diffusion oil

  • Diffusion pump

  • Dry-pump

  • Feed-through

  • Ferro-fluidic Seal

  • Flange

  • Forming gas

  • Gauge

  • He Purge

  • High vacuum

  • Inert gas

  • Ionizatoin guage

  • Isolation Valve

  • Leak

  • Leak test

  • Load-lock

  • Low vacuum

  • Mass flow controller

  • Nitrogen Purge

  • O-ring

  • Oil

  • Particles

  • Penning gauge

  • Pin-hole

  • Pirani gauge

  • Pressure gauge

  • Pressure tranducer guage

  • Process vacuum

  • Pump-down

  • Purge

  • Rotary pump

  • Rotary seal

  • Rough pump

  • Seal

  • Sublimation

  • Sublimation pump

  • Turbo-pump

  • Ultimate vacuum

  • Ultra-high vacuum

  • Vacuum gauge

  • Vacuum pump

  • Vacuum switch

  • VAT Valve

  • Vent

  • Viton seal

  • X-over

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North Amiercan Nanotech, Inc.                                           Contact Us:

12701 Welcome Lane                                                               P. 612-819-5149

Burnsville, MN 55337                                                              E. northamericananotech@icloud.com

www.northamericananotech.com                                      Skype. dmmontag612