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Avalanche Technology announced production of its 3rd-Gen 22nm MRAM devices

(MRAM Info, Sept. 20) pMTJ STT-MRAM developer Avalanche Technology announced that its latest 3rd-Gen MRAM devices are now in production at its foundry partner, United Microelectronics Corporation (UMC). The company says that its new MRAM chips offer significant density, endurance, reliability and power benefits over existing non-volatile solutions. Avalanche's new Parallel x 32 series is offered as a standard product in various density options and has asynchronous SRAM-compatible read/write timings. Avalanche also says that it will soon start developing 16Gb MRAM chips. Avalanche's new chips offer >1014 write cycle endurance and 1,000-year retention (at 85°C). There are two density options, available in a small footprint 142-ball FBGA (15mm x 17mm) package. The devices are offered in the extended (-40°C to 125°C) operating temperature range with a JEDEC qualification flow.


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